XPeng opens its smart-vehicle stack and physical-AI ecosystem to global partners

At the Paris Motor Show the company set a humanoid mass-production target of late 2026, with deliveries in the first half of 2027.

XPeng has unveiled a smart-mobility solutions business called "XPENG AI ENGINEERING," opening its smart-vehicle technology to global partners alongside a collaboration framework for its physical-AI ecosystem. Chairman and CEO He Xiaopeng presented the program at the Paris Automotive Summit during the 2026 Paris Motor Show.

The smart-vehicle framework spans full-vehicle platforms, modular technologies and toolchains. The company says its E/E architecture runs on 10-gigabit Ethernet, accelerating in-car data transmission by 33 times, with by-wire chassis and L3-targeted safety redundancies.

On the modular front, the package covers autonomous driving, an AI BOX, semiconductors, batteries and e-motors. Highlights include Turing AI driving powered by a second-generation VLA large model, the Turing AI chip, an 8C ultra-fast-charging battery that the company says charges from 10% to 80% in eight minutes, and an AI BOX it says can run a 30-billion-parameter mixture-of-experts model.

XPeng's physical-AI ecosystem extends to humanoid robots, robotaxis, flying cars, the Turing AI chip and foundation models for the physical world. Mass production of its humanoid robot is slated for late 2026, with deliveries following in the first half of 2027. Flying cars have already secured over 7,000 orders, while the robotaxi unit — branded XPENGYOYO — is in talks with multiple European mobility platforms.

The company's NGP assisted-driving system has kicked off its first large-scale public test in Europe, with global customer rollouts planned from 2027. Automakers that started as car companies are now selling an AI platform — and XPeng wants partners to build on it rather than around it.